Lead frame and method of manufacturing the same
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United States of America Patent
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N/A
Issued Date -
Mar 11, 2004
app pub date -
Sep 4, 2003
filing date -
Sep 5, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A lead frame includes a frame portion and a plurality of land-like conductor portions arranged in a lattice pattern in a region within the frame portion. The frame portion and the land-like conductor portions are supported by an adhesive tape. Each of the land-like conductor portions is formed of part of each of a plurality of leads at a portion where each lead intersects each other, the plurality of leads being discontinuously arranged so as to be orthogonal to each other. Each portion where the leads intersect each other is formed to be larger than a width of the corresponding lead.
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