Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
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United States of America Patent
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-
Jul 22, 2008
Grant Date -
Mar 18, 2004
app pub date -
Sep 8, 2003
filing date -
Apr 12, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming a core for and forming a composite wiring board. The core has an electrically conductive coating on at least one face of a dielectric substrate. At least one opening is formed through the substrate extending from one face to the other and through each conductive coating. An electrically conductive material is dispensed in each of the openings extending through the conducting coating. At least a portion of the surface of the conductive coating on one face is removed to allow a nub of the conductive material to extend above the substrate face and any remaining conductive material to thereby form a core that can be electrically joined face-to-face with a second core member or other circuitized structure.
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