High density electronics assembly and method
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United States of America Patent
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Issued Date -
Mar 25, 2004
app pub date -
Jul 25, 2003
filing date -
Jul 25, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A high density electronics assembly which is highly modular in nature, thereby allowing a user to configure the assembly as desired for particular applications. The assembly also advantageously utilizes electronics inserts that are standardized across varying configurations, thereby obviating the need for different inserts for different applications. In one exemplary embodiment, the assembly comprises a low-profile Digital Subscriber Line (DSL) splitter apparatus, having a plurality of splitter circuits disposed within a housing structure in high density. Methods for manufacturing and configuring the assembly are also disclosed.
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