Polymerized hydrogel adhesives comprising low amounts of residual monomers
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United States of America Patent
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app pub date -
Aug 14, 2003
filing date -
Mar 30, 2001
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Abstract
The present invention relates to polymerized hydrogel adhesives, in particular those wherein the hydrogel is formed from monomers which include acrylamido-2-methane propanesulfonic acid or salts thereof (AMPS monomers) and those which contain glycerol as a humectant. In such adhesives, the levels of unpolymerized residual monomers, such as unpolymerized AMPS, acrylonitrile, acrylamide and t-butyl acrylamide; and the levels of other impurities such as acrolein, are kept very low. The present invention also relates to a process for making hydogel adhesives with very low levels of such unwanted materials. Such a process involves preparation of reaction mixtures under selected pH and/or temperature conditions and polymerization of AMPS monomers using selected conditions of pH and UV curing.
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