Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 4, 2005
Grant Date -
Apr 8, 2004
app pub date -
Aug 2, 2003
filing date -
Sep 17, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming wire bond z-interconnects between the upper and lower substrates.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully