Method and apparatus for providing accurate junction temperature in an integrated circuit
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United States of America Patent
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N/A
Issued Date -
Apr 8, 2004
app pub date -
Oct 4, 2002
filing date -
Oct 4, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus for providing a more accurate reading of the junction temperature within an Integrated Circuit (IC) where temperature sensing elements are used that are sensitive to process changes. The apparatus stores an offset value in the IC that is used by internal temperature reading circuitry to adjust the temperature read/calculated from the sensing elements to more accurately reflect the actual junction temperature.
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