Process for producing ceramic circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Apr 15, 2004
app pub date -
Oct 9, 2002
filing date -
Aug 9, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A paste of brazing material of Ag--Cu--Ti--TiO.sub.2 system is printed to both sides of an AlN substrate; a copper sheet is then placed on both sides and heated in vacuum to be joined to the substrate. A resist having a desired-circuit pattern is coated on the surface of each copper sheet and etching is performed. A solution containing a mixture of EDTA, ammonia and aqueous hydrogen peroxide is then applied to dissolve away the unwanted brazing material and the like from between the circuit patterns without corroding the ceramic substrate and the metal sheet.
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