Chip alignment and placement apparatus for integrated circuit, mems, photonic or other devices

United States of America Patent

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Issued Date
Apr 15, 2004
app pub date
Oct 15, 2002
filing date
Oct 15, 2002

priority date (Note)
Abandoned

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Abstract

Devices for manipulating, receiving and dispensing diced semiconductor materials, in which the semiconductor material is diced to provide partially connected dice in linear aggregations.

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Patent Owner(s)

Patent Owner	Address
MEADWESTVACO CORPORATION	501 SOUTH 5TH STREET RICHMOND VA 23219-0501

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Bauer, Donald G	Laurel, MD	14	720
Bryden, Michelle D	Ellicott City, MD	3	58
Collins, Richard A	Ellicott City, MD	7	208
Spedden, Richard H	Clarksville, MD	16	261

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Chip alignment and placement apparatus for integrated circuit, mems, photonic or other devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10269326

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APP PUB NO	20040072385A1
SERIAL NO	10269326
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10269326

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