Dual mode hybrid control and method for CMP slurry

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United States of America Patent

PATENT NO 6926584
APP PUB NO 20040072503A1
SERIAL NO

10267614

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Abstract

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A DMHC (dual mode hybrid control) system and method which facilitates enhanced control in the delivery of polishing slurry to a CMP (chemical mechanical polishing) apparatus. The DMHC comprises a linear table and a PID (proportional integrated differential) controller operably connected to a slurry pump provided in a slurry flow conduit which delivers the polishing slurry to the CMP apparatus. A bubble trap and a flowmeter provided in the slurry flow conduit downstream of the slurry pump are operably connected to the PID controller, and the CMP apparatus is located downstream of the flowmeter.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chao-Jung Yunghe, TW 6 15
Chen, Ping-Hsu Taichung, TW 23 165
Huang, Chien-Ling Hsinchu, TW 4 17
Lo, Jui-Cheng Hsinchu, TW 7 53
Lu, Chien-Kuo Hsinchu, TW 10 10
Peng, Chin-Hsin Hsin-Chu, TW 8 32

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