Importance

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Abstract

A component placement machine is provided with an activator application station for application of an adhesive activator to an appropriate surface of a surface-mount component. The application station includes an activator reservoir and wick that provide activator to a porous pad by capillary action. The reservoir and wick are substantially sealed from the environment to prevent unnecessary evaporation of the activator. The component placement machine operating program is modified to include the steps of bringing a component to the applicator station, dabbing the component surface against the applicator pad and returning the component to its installation path. A second adhesive component may be pre-applied to the PCB by an adhesive dispenser as is known in the art. The two-part chemically activated adhesive permits rapid low-temperature curing. The invention allows cost-effective fixture of temperature-sensitive surface-mount components to a PCB.

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First Claim