Structural design of alignment mark
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United States of America Patent
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Issued Date -
Apr 22, 2004
app pub date -
Dec 5, 2002
filing date -
Oct 22, 2002
priority date (Note) -
Abandoned
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Abstract
A structural design for an alignment mark on a substrate having a plurality of layers thereon. The alignment mark is formed within a first dielectric layer above the substrate and a patterned metallic layer is formed within a second dielectric layer underneath the first dielectric layer. The patterned metallic layer includes a group of longitudinal metallic lines separated from each other by a distance smaller than the wavelength of light used in the aligning operation.
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