What is disclosed is a plug-in connector in through-hole technology that is suited for the surface soldering technique. The plug-in connector includes an insulating carrier part wherein a multiplicity of wafers each having soldering tags and contact terminals are inserted. In accordance with the invention, the wafers are placed at a distance from each other, whereby flow channels for supplying the heat transport medium, e.g. air, are created. In an advantageous alternative or additional development of the invention, there is formed in the range of the feedthrough a flow space permitting a flow of the heat transport medium perpendicularly to the plane of the platelets. This passage may be formed by a recess of the insulating material or by suitable spacer elements.
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