Package structure and method for making the same
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United States of America Patent
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Aug 31, 2004
Grant Date -
May 6, 2004
app pub date -
Oct 30, 2002
filing date -
Oct 30, 2001
priority date (Note) -
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Abstract
A package structure and method for making devices of system-in-a-package (SiP). Substrates with integrated and assembled elements can be aligned and pre-bonded together, and fluidic encapsulating materials is applied to seal the rest opening of pre-bonded interface of substrates. Three dimensional and protruding microstructures, elements, and MFMS devices can be accommodated and protected inside a spatial space formed by the bonded substrates. By applying the technologies of flip-chip, chip-scale-packaging, and wafer-level-packaging in conjunction with present invention, then plural elements and devices can be packaged together and become a system device in wafer-level-system-in-a-package (WLSiP) format.
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