Co-fired capacitor and method for forming ceramic capacitors for use in printed wiring boards
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United States of America Patent
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Issued Date -
May 27, 2004
app pub date -
Aug 29, 2003
filing date -
Oct 11, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A capacitor structure is fabricated by forming a pattern of first dielectrics over a foil, forming first electrodes over the first dielectrics, and co-firing the first dielectrics and the first electrodes. Co-firing of the dielectrics and the electrodes alleviates cracking caused by differences in thermal coefficient of expansion (TCE) between the electrodes and the dielectrics. Co-firing also ensures a strong bond between the dielectrics and the electrodes. In addition, co-firing allows multi-layer capacitor structures to be constructed, and allows the capacitor electrodes to be formed from copper.
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