B-stageable die attach adhesives

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7176044
APP PUB NO 20040102566A1
SERIAL NO

10459601

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Forray, Deborah Derfelt San Diego, CA 3 128
Liu, Puwei San Diego, CA 34 630
Santos, Benedicto delos San Diego, CA 3 121

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