Development apparatus for manufacturing semiconductor device
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United States of America Patent
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Apr 11, 2006
Grant Date -
Jun 3, 2004
app pub date -
Oct 2, 2003
filing date -
Oct 8, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A development apparatus for discharging a developer onto a surface of a semiconductor substrate (15) comprises a nozzle pipe (13) for supplying the developer, and a nozzle (14) having a shape of a spoon with a taper and discharging the developer supplied by the nozzle pipe onto the surface of the substrate. The nozzle sprays the developer onto the surface of the substrate at any spray angle under a low and constant pressure.
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