Substrate processing apparatus
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United States of America Patent
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May 6, 2008
Grant Date -
Jun 3, 2004
app pub date -
Feb 12, 2003
filing date -
Feb 12, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.
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