Method and polishing pad design enabling improved wafer removal from a polishing pad in a CMP process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 10, 2004
app pub date -
Mar 7, 2003
filing date -
Dec 4, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
The invention provides a chemical mechanical polishing pad and method that enables improved wafer removal from the polishing pad after completion of chemical mechanical polishing of the wafer.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully