Ball grid array resistor network
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United States of America Patent
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-
May 24, 2005
Grant Date -
Jun 10, 2004
app pub date -
Dec 4, 2002
filing date -
Dec 4, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.
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