Electronic device module
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United States of America Patent
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N/A
Issued Date -
Jun 17, 2004
app pub date -
Sep 5, 2003
filing date -
Sep 5, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electronic device module comprises a wiring substrate having an insulating substrate with a porous structure including continuous pores and wiring conductors selectively formed in the porous structure; and an electronic device directly connected to said wiring conductors formed in the porous structure. A manufacturing method of an electronic device module comprises mounting an electronic device on a surface of an insulating substrate having a porous structure including continuous pores and including photosensitive material which produces or vanishes ion exchange groups upon exposure to energy rays using a mask; exposing the energy rays to change the photosensitive material; and performing electroless plating to form wiring conductors in continuous pores generated by the change of the photosensitive material.
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