Integrated circuit assembly
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United States of America Patent
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Jun 23, 2009
Grant Date -
Jun 17, 2004
app pub date -
Dec 12, 2002
filing date -
Dec 12, 2002
priority date (Note) -
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status (Latency Note)
Importance
Abstract
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical conductors on the substrate or to pads on another die attached to the substrate. The substrate may have one or more openings, exposing pads of the die. The assembly may comprise one or more dice.
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