Sheet having microsized architecture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 1, 2004
app pub date -
Jan 17, 2003
filing date -
Jan 18, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sheet (20) for use in microfluidic, microelectronic, micromechanical, and/or microoptical applications requiring through-flow, through-conductivity, through-transmission, and/or other through patterns. The sheet (20) includes micro-sized architecture including at least one via (22) extending through the thickness of the layer of thermoplastic material. The via-defining walls in the thermoplastic layer are formed by the thermoplastic material flowing around a projection and then solidifying around the projection.
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Cited Art Landscape
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