Electronic device, method of manufacture of the same, and sputtering target
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United States of America Patent
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Aug 29, 2006
Grant Date -
Jul 1, 2004
app pub date -
Dec 17, 2003
filing date -
Dec 19, 2002
priority date (Note) -
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Abstract
In an electronic device comprising a first electrodes consisting of a metal oxide and a second electrode consisting of an aluminum alloy film directly contacted and electrically connected to the first electrode, the contact interface between the aluminum alloy film and the first electrode is constructed so that at least a part of alloy components constituting the aluminum alloy film exist as a precipitate or concentrated layer. This construction enables direct contact between the aluminum alloy film and the electrode consisting of a metallic oxide and allows elimination of a barrier metal in such an electronic device, and manufacturing technology therefor.
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