Polyamide resin composition for fuse element and fuse element
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United States of America Patent
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N/A
Issued Date -
Jul 8, 2004
app pub date -
Oct 16, 2003
filing date -
Apr 19, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Polyamide resin composition for fuse element consisting of 95-5% by mass of polyamide copolymer(A) and 5-95% by mass of polyamide homopolymer(B). Above-mentioned polyamide resin composition for fuse element, wherein a silicate layer(C) of swellable lamellar silicate is dispersed on molecular order level and the content of the silicate layer(C) is 0.1-20% by mass. A fuse element which has a housing and a pair of terminals projecting from the prescribed flat surface of the housing and standing in a parallel and accommodates a fuse-element connecting between the base ends of said two terminals in said housing, wherein the housing is made of said polyamide resin composition.
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