Semiconductor device, its manufacturing method and electronic device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 15, 2004
app pub date -
Nov 21, 2003
filing date -
Nov 25, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor device includes a base substrate including a base wiring pattern. A first circuit substrate is disposed over the base substrate and includes a first wiring pattern. A first semiconductor element is mounted on the first circuit substrate and includes a first electrode that is electrically connected to the first wiring pattern. A second circuit substrate is disposed over the first circuit substrate and includes a second wiring pattern and a second semiconductor element is mounted on the second circuit substrate and includes a second electrode that is electrically connected to the second wiring pattern. A first protruded electrode is electrically connected to the first wiring pattern and provided protruding from the first circuit substrate and bonded to the base wiring pattern and a second protruded electrode is electrically connected to the second wiring pattern and provided protruding from the second circuit substrate and bonded to the base wiring pattern.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully