Advanced packaging shell for pocketable consumer electronic devices
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United States of America Patent
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N/A
Issued Date -
Jul 15, 2004
app pub date -
Jan 7, 2004
filing date -
Jan 9, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for encapsulating electronic components in consumer electronic devices is disclosed. A sealed packaging shell for electronic components is created from a single monolithic piece of elastomeric material. Electronic components, including a PCB, are hermetically encapsulated within the packaging shell during the process of its formation.
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