Method and apparatus for separating composite substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jul 15, 2004
app pub date -
Jan 10, 2003
filing date -
Jun 21, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and an apparatus for separating a composite substrate 1 by which the composite substrate 1 is warped to cause a crack and grow it in a separation region 6, a silicon substrate 2 constituting the composite substrate 1 is separated along the separation region 6, and the silicon substrate 2 is separated from the composite substrate 1 with ease.
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