Wl-bga for MEMS/MOEMS devices

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20040140557A1
SERIAL NO

10347344

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A MEMS/MOEMS device is provided on a first substrate which is bonded to a second substrate to form a package. Interconnections may be provided via the second substrate and an hermetic seal may be formed to protect the MEMS/MOEMS device from outgassing.

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Patent Owner(s)

Patent OwnerAddress
UNITED TEST & ASSEMBLY CENTER LIMITED5 SERANGOON NORTH AVENUE 5 554916

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chong, Yok Rue Desmond Singapore, SG 2 102
Kapoor, Rahul Singapore, SG 59 984
Sun, Yi-Sheng San Jose, CA 3 132

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