Systems including heated shower heads for thin film deposition and related methods
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United States of America Patent
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Issued Date -
Aug 5, 2004
app pub date -
Jul 17, 2003
filing date -
Jul 18, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A deposition apparatus is disclosed for depositing a layer on a substrate such as a semiconductor wafer. The deposition apparatus may include a process chamber, and a susceptor in the process chamber with the susceptor being configured to receive a substrate for depositing a thin layer thereon. The deposition apparatus may also include a showerhead on a side of the process chamber with the showerhead being configured to receive reaction gases and to introduce the reaction gases into the process chamber. The showerhead may include a heating element therein for heating reaction gases prior to introducing the reaction gases into the reaction chamber. Related methods are also discussed.
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