Lead-free alloys, composition thereof, methods of preparation and uses for soldering and babbitting
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United States of America Patent
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Feb 4, 2003
filing date -
Feb 4, 2003
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Abstract
Lead-free alloys comprising tin, copper, antimony, silver and a lanthanide metal are disclosed. Also disclosed are methods of preparing the lead-free alloys and their use for soldering and babbitting. The lead-free solder alloys exhibit improved tensile and shear strength, and they exhibit flow characteristics similar to those of 50:50 tin:lead alloys.
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