Flow field plates and a method for forming a seal between them
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United States of America Patent
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N/A
Issued Date -
Aug 5, 2004
app pub date -
Apr 2, 2004
filing date -
May 3, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A flow field plate having a plurality of protrusions formed integrally on at least on surface, said protrusions being adapted in use to join the flow field plate to an adjacent flow field plate. The material of the plate may be an electrically conductive polymer, which may comprise a conductive filler and carbon nanofibres. The plates may be welded together by ultrasonic welding.
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