Polishing liquid, polishing method and polishing apparatus
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United States of America Patent
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Issued Date -
Aug 12, 2004
app pub date -
Feb 12, 2003
filing date -
Feb 12, 2003
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a polishing liquid for polishing the surface of a substrate having a copper film and fine recesses filled with the copper, comprising, at least one water-soluble inorganic acid or its salt, or water-soluble organic acid or its salt, and at least one hydroxyquinoline.
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