Molding compound
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United States of America Patent
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N/A
Issued Date -
Aug 12, 2004
app pub date -
Nov 26, 2003
filing date -
Dec 23, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
There is disclosed a molding compound. The molding compound preferably includes a macrocyclic oligoester that reacts with itself, a secondary compound or another macrocyclic oligoester during molding of the molding compound. Exemplary secondary compounds include a cyclic ester, a dihydroxyl-functionalized polymer or the like.
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