MEM device processing with multiple material sacrificial layers
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United States of America Patent
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Issued Date -
Aug 19, 2004
app pub date -
Feb 13, 2004
filing date -
Feb 19, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to processes for preparing microelectromechanical (MEM) devices. Multimaterial sacrificial layers are used in the processes of the invention, thus allowing for the fabrication of sophisticated devices. The invention also relates to MEM devices prepared according to the processes of the invention and to pre-MEM devices.
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