Three-dimensional electrical device packaging employing low profile elastomeric interconnection
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United States of America Patent
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Issued Date -
Aug 19, 2004
app pub date -
Feb 11, 2004
filing date -
Feb 14, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A compliant interconnect for compactly, releasably packaging vertically-spaced electrical devices. The compliant interconnect includes at least one substrate for supporting and electrically connecting to the electrical devices, a layer of anisotropic conductive elastomer (ACE) between each electrical device and each immediately adjacent electrical device, and a layer of ACE between the substrate and the electrical device closest to the substrate. The ACE layers provide electrical connection through the package, and also conduct heat from the electrical devices. There is also a device that applies a compressive load to each of the ACE layers
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