Method and apparatus for examining semiconductor wafers in a context of die/SAW design
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 26, 2004
app pub date -
Feb 5, 2004
filing date -
Feb 21, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention takes into account the fact that the size of the SAWs varies greatly depending on the stepper and the die size (design). In general, it cannot be assumed that one SAW can be imaged with one camera image. A SAW is preferably broken down into regular logical parts (segments) of identical size. A SAW index is allocated to each logical SAW segment. One image field of the camera can image only a certain number of these SAW segments. An index, hereinafter called an image field segment index, is allocated to each segment of an image field, hereinafter called an image field segment.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully