Device cover having a gapped adhesive preform thereon for covering a device on an electronic substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 2, 2004
app pub date -
Nov 10, 2003
filing date -
Jun 23, 1998
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A device cover for covering a device on an electronic substrate according to the invention comprises a cover having a bonding surface defining a closed bonding pattern, and a bonding pattern of adhesive on the bonding surface of the cover. The bonding pattern of adhesive has at least one gap therein, wherein the gap is sufficiently small as to be filled by the adhesive when the adhesive flows when the cover is adhered to the electronic substrate.
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