Intermediate board, intermediate board with a semiconductor device, substrate board with an intermediate board, structural member including a semiconductor device, an intermediate board and a substrate board, and method of producing an intermediate board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 9, 2004
app pub date -
Mar 18, 2004
filing date -
Mar 19, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An intermediate board comprising: an intermediate board body having first and second faces wherein a semiconductor device is to be mounted on at least one of said first and second faces, said semiconductor device having a coefficient of thermal expansion that is equal to or larger than 2.0 ppm/.degree. C. and smaller than 5.0 ppm/.degree. C., and having surface mount terminals, said intermediate board body having a plurality of through holes through which said first and second faces communicate with each other, said intermediate board body containing an inorganic insulating material; and a plurality of conductor columns filling said through holes and containing a conductive metal, said conductor columns being to be connected with said surface mount terminals.
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