Method and device for laser beam machining of laminated material
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United States of America Patent
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app pub date -
Nov 10, 2003
filing date -
May 11, 2001
priority date (Note) -
Abandoned
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Abstract
A method of the present invention is a method for processing a multilayer material, in which one or more conductor layers and insulating layers are layered, with a laser beam. The method includes the step of irradiating the conductor layer with a first laser beam to form a hole at a processing point in the conductor layer, and the step of irradiating the hole with a second laser beam to process the insulating layer, layered on the conductor layer. The second laser beam has a smaller beam diameter at the processing point than the first laser beam.
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