Spatially optimized thermoelectric module
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United States of America Patent
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Issued Date -
Sep 16, 2004
app pub date -
Mar 10, 2003
filing date -
Mar 10, 2003
priority date (Note) -
Abandoned
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Abstract
A semiconductor thermoelectric module includes a first semiconductor element formed from a first composition. A second semiconductor element is formed from a second composition. The second semiconductor element is connected electrically in series with the first semiconductor element via an electrical conductor, and the second composition differs from the first composition.
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