High conductivity inks with low minimum curing temperatures
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United States of America Patent
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app pub date -
Jan 26, 2004
filing date -
Jan 29, 2003
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Abandoned
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Abstract
Conductive ink compositions which can be cured to highly conductive metal traces by means of 'chemical welding' include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.
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