Structures for testing circuits and methods for fabricating the structures
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United States of America Patent
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app pub date -
Apr 16, 2003
filing date -
Mar 12, 2003
priority date (Note) -
Abandoned
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Abstract
One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a Probe Card; (b) a substrate having contactors on a first side and pads on a second side, wherein a non-RF group of pads on the second side are used to test non-RF I/O of the circuit and an RF group of pads on the second side are used to test RF I/O of the circuit; and (c) an RF interface board having a non-RF group of pads and an RF group of the pads on a first side, and a non-RF group of pads and a group of RF coaxial cable connectors on a second side.
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