Package for housing semiconductor chip, and semiconductor device
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United States of America Patent
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N/A
Issued Date -
Sep 23, 2004
app pub date -
Oct 7, 2003
filing date -
Oct 22, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a semiconductor package allowing a semiconductor chip to be operated accurately and with high stability over a long period by effectively transferring the heat generated during the operation of the semiconductor chip to a heat sink. A package for housing a semiconductor chip comprises a substrate 2 having on the upper surface thereof a mounting space where a semiconductor chip 1 is to be mounted, a frame 3 being provided so as to surround the mounting space on the upper surface of the substrate 2 and having a joint 3a for an input/output terminal 5 on the side, and an input/output terminal 5 connected to the joint 3a, wherein the substrate 2, or part of the substrate 2, or the substrate 2 and the frame 3, or part of the substrate and the frame is formed from a metal-diamond composite in which a matrix material having diamond particles joined via a metal carbide is infiltrated with a copper and/or silver or a metal-diamond sintered body composed of diamond particles and copper. Further, the surface of the metal-diamond composite is plated with gold.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SUMITOMO ELECTRIC INDUSTRIES LTD | OSAKA-SHI OSAKA 541-0041 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kawai, Chihiro | Itami-shi, JP | 25 | 258 |
Saito, Hirohisa | Itami-shi, JP | 45 | 350 |
Tanaka, Motoyoshi | Itami-shi, JP | 8 | 55 |
Tsuno, Takashi | Itami-shi, JP | 49 | 500 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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