Process chamber component having electroplated yttrium containing coating
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United States of America Patent
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May 13, 2008
Grant Date -
Sep 30, 2004
app pub date -
Apr 13, 2004
filing date -
Jan 8, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating is resistant to corrosion in the plasma, and can have a compositional gradient of yttrium-containing species through a thickness of the coating. In one embodiment, the coating is formed by electroplating a layer comprising yttrium onto the surface, and then electroplating a second layer onto the first layer, and annealing the first and second layers. The second layer can comprise aluminum or zirconium. In another embodiment, the coating is formed by electroplating a layer comprising a mixture of aluminum and yttrium onto the surface and annealing the layer.
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