Method of packaging circuit device and packaged device

United States of America Patent

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Issued Date
Oct 7, 2004
app pub date
Apr 1, 2003
filing date
Apr 1, 2003

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Abandoned

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Abstract

A method of packaging circuit devices in which a heat slug is inserted into an aperture in the substrate. A heat slug is therefore incorporated into the package without adding to the total size or weight of the package.

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Patent Owner(s)

Patent Owner	Address
UNITED TEST & ASSEMBLY CENTER LTD	5 SERANGOON NORTH AVENUE 5 SINGAPORE 554916

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Boon, Tan Hien	Singapore, SG	3	203
Gill, Park Soo	Singapore, SG	1	2
Hao, Liu	Singapore, SG	7	113

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Method of packaging circuit device and packaged device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10403040

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APP PUB NO	20040195697A1
SERIAL NO	10403040
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