Optical communication between face-to-face semiconductor chips
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United States of America Patent
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May 6, 2008
Grant Date -
Oct 7, 2004
app pub date -
Apr 2, 2004
filing date -
Apr 2, 2003
priority date (Note) -
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Abstract
One embodiment of the present invention provides a system that communicates between a first semiconductor die and a second semiconductor die through optical signaling. During operation, the system converts an electrical signal into an optical signal using an electrical-to-optical transducer located on a face of the first semiconductor die, wherein the first semiconductor die and the second semiconductor die are oriented face-to-face so that the optical signal generated on the first semiconductor die shines on the second semiconductor die. Upon receiving the optical signal on a face of the second semiconductor die, the system converts the optical signal into a corresponding electrical signal using an optical-to-electrical transducer located on the face of the second semiconductor die.
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