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Abstract

Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100.degree. C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance--the orifice to substrate distance may be several millimeters--and direct write onto non-planar surfaces is possible. This invention is also of combinations of precision spray processes with in-flight laser treatment in order to produce direct write electronic components, and additionally lines of conductive, inductive, and resistive materials. This development has the potential to change the approach to electronics packaging in that components can be directly produced on small structures, thus removing the need for printed circuit boards.

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First Claim