Stainless steel-copper clad and method for production thereof
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United States of America Patent
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Issued Date -
Oct 7, 2004
app pub date -
Mar 25, 2004
filing date -
Sep 26, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A stainless steel/Cu clad which has high-temperature strength enough to be not easily deformed and be sufficiently practical and high thermal conductivity for a high temperature use, and a manufacturing method of such a clad. The stainless steel/Cu clad of the invention is formed by bonding a high Mn austenitic stainless steel containing 9-16 mass % Mn and Cu metallically. Manufacturing of the stainless steel/Cu clad is carried out as follows. That is, a first sheet made of the high Mn austenitic stainless steel, a second sheet made of Cu, and a third sheet of a heat resisting steel which acts as a peeling material are wound in a coil shape in a state where they are laminated in such order and, subsequently, the obtained coil is vacuum-annealed, thereby bonding them and manufacturing the high Mn austenitic stainless steel/Cu clad having high-temperature strength and high-thermal conductivity.
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