Separating a microkeratome blade from a wafer
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United States of America Patent
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N/A
Issued Date -
Oct 14, 2004
app pub date -
Mar 17, 2003
filing date -
Mar 17, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A blade separation fixture (300) is disclosed. A wafer (130) is positioned on the fixture (300). This wafer (130) includes a plurality of cutting blades (56) that are initially spaced above the fixture (300). Blade handles (24) will typically already have been mounted on each of the various cutting blades (56) at this time. In any case, each of the various cutting blades (56) are separated from the wafer (130) by applying an appropriate downwardly directed force. Separated blades (56) in effect pivot into an inclined position against the fixture (300) without having their corresponding cutting edges (80) contact the fixture (300).
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