Non-homogeneous multilayer circuit assemblies and method of manufacture
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United States of America Patent
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Issued Date -
Oct 21, 2004
app pub date -
Apr 15, 2003
filing date -
Apr 15, 2003
priority date (Note) -
Abandoned
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Abstract
Non-homogeneous multilayer circuit assemblies are formed from circuit substrates, comprised of a layer of polyimide substrate on one or both surfaces of which an electrical circuit has been formed. Multiple circuit substrates, separated by layers of fusible dielectric material, are exposed to sufficient temperature and pressure to bond the multiple layers into a non-homogeneous but cohesive circuit assembly.
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